Product
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D131S
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Fanless/Fan/Carrier Board
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Carrier Board
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NVIDIA GPU SoC Module Compatibility
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NVIDIA Jetson Orin NX / Orin Nano module , Support Super Mode
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Networking
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1x GbE RJ-45 (PoE option)
1xM.2. key E 2230 for Wi-Fi
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Display Output
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1x HDMI (3840 x 2160 at 60Hz) for Orin NX, (3840 x 2160 at 30Hz) for Orin Nano
DP is optional through DP Daughter Board
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Temperature
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Operating temperature: -40°C ~ 85°C (Industrial Type)
Operating temperature: 0°C ~ 70°C (Commercial Type)
Option 0°C~65°C with eDP Sub Board (TBD)
Storage temperature: -40°C ~ 85°C
Relative humidity 40 °C @ 95%, Non-Condensing
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MIPI & SerDes Camera (120-pin)
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2x 4 lane MIPI CSI-2, 22 pin FPC 0.5mm Pitch Connector
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USB
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4x USB 3.2 Type-A
1x USB 2.0 type C for recovery
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Storage
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1x M.2. key M 2280 for SSD
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Expansion Header
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802.3AF PSE board (optional)
OOB board(optional)
5G Daughter Board (optional)
DP Daughter Board (optional)
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Input Power
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Voltage: DC 12~24V
Current: DC IN Jack on board: 10A MAX
ATX 4pin: 10A MAX
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Security
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TPM 2.0 supported
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Power Cord
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19V/4.73A adapter and US/JP/EU/UK/TW/AU/CN power cord (optional)
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Thermal Solution
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Heat sink with fan (optional)
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Buttons
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Power and Recovery
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RTC Battery
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Support RTC battery and Battery Life Monitoring by MCU
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Dimensions
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113mm(L) x 105 mm(W) (4.45” x 3.43”)
Weight: 101 g
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Certifications
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CE, FCC, VCCI, KC (TBD)
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